I meant positioning the whole case bottom-up (i.e. but the hot surface at the top).
Brian Conway On Mon, Nov 9, 2015 at 9:28 AM, Chris Cappuccio <ch...@nmedia.net> wrote: > Brian Conway [bcon...@rcesoftware.com] wrote: >> >> Taking into account Mr. Cappuccio's advice on using thermal paste >> between the CPU and heat spreader, and also positioning it bottom-up, >> this one stabilized at 51 C at idle. I haven't had a chance to do much >> benchmarking for higher temps yet, other than a run of `openssl speed` >> to warm it up. > > If you put the heat speader upside down, the sticky pad would be against > the cpu heatsink contact area?? There's only one way to put that device in.
