Brian Conway [bcon...@rcesoftware.com] wrote: > > Taking into account Mr. Cappuccio's advice on using thermal paste > between the CPU and heat spreader, and also positioning it bottom-up, > this one stabilized at 51 C at idle. I haven't had a chance to do much > benchmarking for higher temps yet, other than a run of `openssl speed` > to warm it up.
If you put the heat speader upside down, the sticky pad would be against the cpu heatsink contact area?? There's only one way to put that device in.
