Thanks for helping me out with this.


On Sat, Jul 5, 2008 at 4:27 PM, Jeff Soules <[EMAIL PROTECTED]> wrote:

> Latency, risk of failure, sure... also sheer design complexity (since you
> have
> to solve the geometry of fitting more circuitry in the same space), and
> subsequent complexity of fabrication (since you have to actually make
> those tiny little circuits).  There's also heat dissipation, which isn't so
> so
> bad for memory but is still nontrivial.
> Using smaller circuit paths means that the control signals wind up being
> effectively "noisier" too (or so I understand), which affects a whole slew
> of things, including memory timings among others.
>
> At least this is all what I remember...!
>
> On Sat, Jul 5, 2008 at 2:24 PM, Mag Gam <[EMAIL PROTECTED]> wrote:
> >
> > Thanks for the responses.
> >
> > What is the engineering challenge of having more memory in a single die?
> I expect latency would be a issue. Also, as Brad mentioned greater risk of
> failure.
> >
> > Any thing else?
> >
> >
> >
> > On Fri, Jul 4, 2008 at 11:04 AM, <[EMAIL PROTECTED]> wrote:
> >>
> >> >
> >> >
> >> >
> >> >---- Original Message ----
> >> >From: [EMAIL PROTECTED]
> >> >To: [email protected]
> >> >Subject: RE: memory question (hardware)
> >> >Date: Thu, 3 Jul 2008 01:08:10 -0400
> >> >
> >> >>I am curious...
> >> >>
> >> >>
> >> >>When memory is manufactured why does a stick of 4GB memory cost 2.5
> >> >times of
> >> >>2GB memory? Is the manufacturing process that much different to
> >> >justify the
> >> >>cost?
> >>
> >> Obviously we can't open up the sticks and look at the chips, but the
> >> usual answer is that the 2G used "the older" technology and the 4G
> >> used the "newer" technology and the chip vendor is trying to recoup
> >> development costs.  As the "newer" technology becomes the "older"
> >> technology the cost will go down.  With Moore's "law" this gives the
> >> chip vendor about 18 months to recoup most of the development costs
> >> and some profit.
> >> Larry
> >> >>
> >>
> >>
> >>
> >
>
>
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