Thanks for the responses. What is the engineering challenge of having more memory in a single die? I expect latency would be a issue. Also, as Brad mentioned greater risk of failure.
Any thing else? On Fri, Jul 4, 2008 at 11:04 AM, <[EMAIL PROTECTED]> wrote: > > > > > > > >---- Original Message ---- > >From: [EMAIL PROTECTED] > >To: debian-user@lists.debian.org > >Subject: RE: memory question (hardware) > >Date: Thu, 3 Jul 2008 01:08:10 -0400 > > > >>I am curious... > >> > >> > >>When memory is manufactured why does a stick of 4GB memory cost 2.5 > >times of > >>2GB memory? Is the manufacturing process that much different to > >justify the > >>cost? > > Obviously we can't open up the sticks and look at the chips, but the > usual answer is that the 2G used "the older" technology and the 4G > used the "newer" technology and the chip vendor is trying to recoup > development costs. As the "newer" technology becomes the "older" > technology the cost will go down. With Moore's "law" this gives the > chip vendor about 18 months to recoup most of the development costs > and some profit. > Larry > >> > > > >
