I might (be | have been) a bit paranoid.

Based on information from Intel (listed below) I've found that for my
particular processor (T7300 2Ghz) that the specs might be a bit more
forgiving than I originally thought.

A heat sink compatible with my processor has to be able to dissipate 35W
of heat - Intel calls this number "Thermal Design Power". The "Thermal
Specification" for the processor is 100 C. Thus, when my CPU is crankin'
out 35W of heat, the temperature measured at the joint between the CPU
and the heat sink should be no more than 100C.

>From Intel.com:

Thermal Design Power:

Thermal Design Power:  (Also referred to as Thermal Guideline) The
maximum amount of heat which a thermal solution must be able to
dissipate from the processor so that the processor will operate under
normal operating conditions.

Thermal Specification:

Thermal Specification:  The thermal specification shown is the maximum
case temperature at the maximum Thermal Design Power (TDP) value for
that processor. It is measured at the geometric center on the topside of
the processor integrated heat spreader. For processors without
integrated heat spreaders such as mobile processors, the thermal
specification is referred to as the junction temperature (Tj). The
maximum junction temperature is defined by an activation of the
processor Intel® Thermal Monitor. The Intel Thermal Monitor’s automatic
mode is used to indicate that the maximum TJ has been reached.

-- 
Hardy does not control the CPU fan properly.
https://bugs.launchpad.net/bugs/224876
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