On 27.06.2014. 08:59, Mihai Popescu wrote:
It think the designer wanted to keep the board compatible with the old case, or the other way around. To cool the CPU more one needs better pads ( i doubt there are much better, since the industry has standards) or adds a fan.Current situation is like this: \__________/ - CPU ------------------------------------ - PAD ================== - Aluminium heatsink ------------------------------------ - PAD .................................... - CASE A better approach is a cast aluminium case, but this is too expensive. So one can do pressed steel sheet like this: \__________/ - CPU ------------------------------------ - PAD ..................... ....../ \....... - CASE ^^^^^^^ bend area This way, one pad and the extra aluminium heat spreader can be out of equation. Of course, and extra bending of the bottom sheet is needed. Maybe the price will go higher, maybe the CPU is too far and the bending distance
I would try to replace the aluminium sheet with a copper one. It would be also good to make it thicker, in order to avoid thermal pads and use thermal paste instead (to additionally lower thermal resistance). Finally, increasing the area of this sheet would also help, preferably to cover the entire bottom of the box.
