Document the optional #cooling-cells property for Qualcomm PAS
remoteproc nodes so they can be used as thermal cooling devices via
the QMI Thermal Mitigation Device (TMD) interface.
Qualcomm remote processors expose TMD endpoints that support thermal
throttling through firmware. The cooling-device specifier uses 3 cells:
<&phandle device_id min_state max_state>
where device_id selects the TMD endpoint (for example PA, modem, or
CDSP software mitigation), with constants defined in:
include/dt-bindings/thermal/qcom,qmi-tmd.h
Example usage in a thermal zone:
cooling-maps {
map0 {
trip = <&cpu_alert>;
cooling-device = <&remoteproc_cdsp
QCOM_TMD_CDSP_SW
0 THERMAL_NO_LIMIT>;
};
};
Signed-off-by: Gaurav Kohli <[email protected]>
---
.../bindings/remoteproc/qcom,pas-common.yaml | 9 +++++++++
MAINTAINERS | 1 +
include/dt-bindings/thermal/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
3 files changed, 30 insertions(+)
diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
index 11faf655f530..39e79a1c1079 100644
--- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
+++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
@@ -77,6 +77,15 @@ properties:
channels and devices related to the ADSP.
unevaluatedProperties: false
+ '#cooling-cells':
+ description: |
+ Cooling device with three cells:
+ Cell 0: Cooling device id as defined in
+ include/dt-bindings/thermal/qcom,qmi-tmd.h
+ Cell 1: Minimum cooling state
+ Cell 2: Maximum cooling state
+ const: 3
+
glink-edge:
$ref: /schemas/remoteproc/qcom,glink-edge.yaml#
description:
diff --git a/MAINTAINERS b/MAINTAINERS
index dcffe9fc54f6..2d4d19201aec 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -3423,6 +3423,7 @@ F: drivers/watchdog/gunyah_wdt.c
F: include/dt-bindings/arm/qcom,ids.h
F: include/dt-bindings/firmware/qcom,scm.h
F: include/dt-bindings/soc/qcom*
+F: include/dt-bindings/thermal/qcom,qmi-tmd.h
F: include/linux/firmware/qcom
F: include/linux/soc/qcom/
F: include/soc/qcom/
diff --git a/include/dt-bindings/thermal/qcom,qmi-tmd.h
b/include/dt-bindings/thermal/qcom,qmi-tmd.h
new file mode 100644
index 000000000000..a07a515905e7
--- /dev/null
+++ b/include/dt-bindings/thermal/qcom,qmi-tmd.h
@@ -0,0 +1,20 @@
+/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
+/*
+ * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices
+ *
+ * These indices are used in device tree cooling-maps to reference
+ * specific TMD devices provided by remote processors via QMI.
+ *
+ * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
+ */
+#ifndef _DT_BINDINGS_THERMAL_QCOM_QMI_TMD_H
+#define _DT_BINDINGS_THERMAL_QCOM_QMI_TMD_H
+
+/* CDSP thermal mitigation device id */
+#define QCOM_TMD_CDSP_SW 0
+
+/* Modem thermal mitigation device id */
+#define QCOM_TMD_PA 0
+#define QCOM_TMD_MODEM 1
+
+#endif /* _DT_BINDINGS_THERMAL_QCOM_QMI_TMD_H */
--
2.34.1
