On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote: > Add Device Tree binding constants for Qualcomm Thermal Mitigation > Device (TMD) types used by remoteproc-backed thermal cooling devices. > > Qualcomm remote processors expose thermal mitigation endpoints > through QMI. These endpoints can be registered with the thermal > framework via the `#cooling-cells` property on the remoteproc node. > > The QMI TMD protocol identifies devices using string names (for example, > "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with > `#cooling-cells = <3>` requires numeric device id in the form: > > <&phandle device_id min_state max_state> > > Define common TMD device index constants shared across currently > supported platforms. If a future target requires a different mapping, > additional target-specific constants can be introduced while preserving > existing DT ABI. > > Signed-off-by: Gaurav Kohli <[email protected]> > --- > MAINTAINERS | 1 + > include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
Why is it put into firmware? What part of firmware are you describing? To me it looks like thermal thing and even you wrote: Thermal Mitigation Device Best regards, Krzysztof
