On 12/03/2021 12:15, Lukasz Luba wrote: > > > On 3/10/21 11:45 AM, Daniel Lezcano wrote: >> Currently the naming of a cooling device is just a cooling technique >> followed by a number. When there are multiple cooling devices using >> the same technique, it is impossible to clearly identify the related >> device as this one is just a number. >> >> For instance: >> >> thermal-devfreq-0 >> thermal-devfreq-1 >> etc ... >> >> The 'thermal' prefix is redundant with the subsystem namespace. This >> patch removes the 'thermal prefix and changes the number by the device > > missing ' after 'thermal > >> name. So the naming above becomes: >> >> devfreq-5000000.gpu >> devfreq-1d84000.ufshc >> etc ... >> >> Signed-off-by: Daniel Lezcano <[email protected]> >> ---
[ ... ] > --------------------------------------------------------- > > We should allocate tmp buffer for it, to not loose the meaningful part > of that string name or end up with only the same prefix, like for the > first 3 from top: > > devfreq-18321000.qco > > or for the GPU: > devfreq-3d00000.qcom > > This is tricky area and vendors might put any non-meaningful prefix. > > The rest of the code looks OK, only this name construction part. That requires a change in the thermal_core code to replace the strlcpy into the cdev->type by a kstrdup. Otherwise the name will be truncated in any case by the underlying thermal_cooling_device_register() function. -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog
