On Saturday, 8 June 2024 18:46:05 BST Dale wrote: > I got the little m.2 thing today. It's a lot smaller than I expected. > A whole lot smaller. It's fairly tiny actually. They look bigger in > pictures or on video. This reminds me of the discussion on the number > of transistors on a chip. I bet they packed tight in there. I bought a > heat sink that goes on each individual chip, one on controller, one on > data chip, two if it has two data chips. Anyway, it has only two chips > so I got extra heat sinks. LOL They fairly large since the mobo has > nothing on top of them. I got plenty of room. That said, anyone else > notice they make heat sinks for those things that have heat pipes and > itty bitty fans?? O_O It does make them run cool tho. :/ I like my > little heat sinks better. Pretty good size and no moving parts. They > come in a couple colors. Linky. > > https://www.ebay.com/itm/254119864180 > > Oh, for those reading this. The data controller chip is a little > thinner than the data chip. I confirmed that on mine. If you don't use > a heatsink that has a thicker pad for that, it leaves a gap and the > controller chip doesn't make contact which means it runs hotter. As I > mentioned earlier, the controller seems to produce more heat so it needs > the heatsink more than the data chip. On videos, some people use a > additional pad to make up the difference on the controller chip.
Additional pad, or alternatively two pads of different thicknesses, with the thicker pad fitted on the controller chip. https://www.youtube.com/watch?v=VIUU5ogVHg8 > I > noticed on a couple heatsinks, they mention the difference and show they > use a pad that makes full contact on both chips. It looks like the > thermal pad is thicker and more squishy. One I saw looks like it is > just a little thicker on the controller end. Thermal pads are spongy and compressible. When you screw down the metal heatsink on the NVMe stick you should find the thermal pad area over the NAND chips will just squish more than over the controller. Not sure if it makes any difference in performance using a single thickness thermal pad, as long as the thickness of it is enough to make good contact with the controller chip, after it has squished over the NAND chips. I would think for normal PC operation using a different heatsink to what the MoBo comes with would be an overkill and it may not make much of a difference anyway. I fitted a single thickness thermal pad on my NVMe and it idles at ~46-47°C pushing up to ~54-57°C when being written to in daily operations. I haven't run any benchmark load tests to see how hot it may get, but with the above temperature range I would think the thermal pad is working fine. :-)
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