On Wed, 30 Nov 2022 21:09:40 +0100, Adam Skladowski wrote: > Document compatible for tsens on Qualcomm SM6115 platform > according to downstream dts it ship v2.4 of IP > > Signed-off-by: Adam Skladowski <[email protected]> > Acked-by: Krzysztof Kozlowski <[email protected]> > --- > Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + > 1 file changed, 1 insertion(+) >
Since Daniel is out, applied, thanks!
