Hello,
On 16/07/2020 17:16, Sebastian Huber wrote:
Hello,
I sent the documentation of the new build system some days ago and at
least Gedare Bloom reviewed it.
https://ftp.rtems.org/pub/rtems/people/sebh/user.pdf
https://ftp.rtems.org/pub/rtems/people/sebh/eng.pdf
I rebased the build system branch to the current master and squashed
all commits:
https://git.rtems.org/sebh/rtems.git/log/?h=build-2
I started the development nearly one year ago and it was basically
production ready in November last year. In the mean time Hesham
Almatary added basic support for clang to it. Doorstop is no longer
used. This simplified the YAML files a bit since no requirements
related attributes are present in the build item files. The item links
are now an ordered list. This simplified the build dependencies. The
item paths are now also shorter since there is no longer a duplication
of the directory path in the file name.
Each build item has a license and a copyright statement list. I didn't
add copyright statements for the BSP option descriptions. If someone
thinks there is a statement missing or the licensing conditions are
not acceptable, we can add/change it later.
I built all BSPs with all tests enabled today using the latest RTEMS 5
tool chain which is based on GCC 10. I had to disable the fenv test
since the ARM support is currently broken.
The build system is ready to be merged from my point of view.
are there any remaining issues which prevent the new build system from
being integrated? At the moment I just sit idle and wait. If there are
technical issues, I can fix them only if I know them.
I have a BSP using the new build system for the STM32H7 chips with
Ethernet and USB host support waiting for integration since April this year.
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